The falcon chips are suffering the same failure rats not surprising seeing as that wasn't the reported problem the soldering was the problem.
Where did you get that the current chips have the same failure rate? I read that article you linked to back in January when it came out. Nowhere does it say that. On the contrary, the article xbox360fanboy is quoting says:
It's around 30%, and all will probably fail early. This quarter they are expecting 1 M failures, most of those Xenons.
Xenons meaning launch units. It goes on to say:
Q: How much more reliable are the current generation of Xbox 360 than the previous designs? Original Xenon, Zypher and Falcon.
I've heard that the failure rates for the current design is sub 10%. Much much better, but still too high imoh. And those designs haven't seen much life yet, so no one knows if that failure rate will hold.
I've heard that the failure rates for the current design is sub 10%. Much much better, but still too high imoh. And those designs haven't seen much life yet, so no one knows if that failure rate will hold.
Q: Let's go over some of the rumored reasons RROD. Could you tell how close each theory is?
Over heating CPU/GPU due to the lead free solder?
They don't overheat due to PB Free. They over heat due to too much power dissipated in too small of an area, w/o a sufficient thermal management design to take the heat away from the junction of the transistors on the chips, the packages themselves, and the mobo. And the over heating is on the GPU. When the CPU heatsink is applied right, it does not over heat.
Over heating CPU/GPU due to the lead free solder?
They don't overheat due to PB Free. They over heat due to too much power dissipated in too small of an area, w/o a sufficient thermal management design to take the heat away from the junction of the transistors on the chips, the packages themselves, and the mobo. And the over heating is on the GPU. When the CPU heatsink is applied right, it does not over heat.
The main design flaw was the excessive heat on the GPU warping the mother board around it. This would stress the solder joints on the GPU and any bad joints would then fail in early life.
Since the old hot GPU has now been replaced with a cooler running GPU, it would follow that the failure rate would be significantly less, which by all accounts has been proved true. Bad soldering is even easier to fix than redesigning the GPU and heatsink, both of which they did, as well as changing the thermal glue.